中国学者近期发表的论文
1.	Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications Author: Hongqiang Zhang, Zhenyu Zhao, Guisheng Zou, Wengan Wang, Lei Liu, Gong Zhang, Y. Zhou Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.94, 46-55, DOI:10.1016/j.microrel.2019.02.002    DOI
2.	The orientational dependence of single event upsets and multiple-cell upsets in 65 nm dual DICE SRAM Author: YinYong Luo, FengQi Zhang, Chen Wei, LiLi Ding, XiaoYu Pan Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.94, 24-31, DOI:10.1016/j.microrel.2019.01.013    DOI
3.	Thermal behaviors of nanoparticle reinforced epoxy resins for microelectronics packaging Author: Hongzhan An, Zhan Liu, Qing Tian, Junhui Li, Can Zhou, Xiaohe Liu, Wenhui Zhu Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.93, 39-44, DOI:10.1016/j.microrel.2019.01.002    DOI
4.	Inhibition of peak electric field shifting on current filaments of high voltage diode Author: Cailin Wang, Lei Zhang, Jing Yang, Wuhua Yang, Qi Zhang Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.94, 13-18, DOI:10.1016/j.microrel.2019.01.008    DOI
5.	Prediction of relations between leaching rate of rare earth mineral and the density of its mother liquid based on HGEP-PTS algorithm Author: Shiliang Zhang, Xiaosheng Liu Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.93, 115-119, DOI:10.1016/j.microrel.2019.01.009    DOI
6.	High robust and cost effective double node upset tolerant latch design for nanoscale CMOS technology Author: Hongchen Li, Liyi Xiao, Jie Li, Chunhua Qi Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.93, 89-97, DOI:10.1016/j.microrel.2019.01.005    DOI
7.	Qcrit-independent model method for proton SEU analysis Author: Yancun Li, Dengyun Yu, Qingxiang Zhang, Zhenbo Cai, Xiaoyu Jia, Ying Wang Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.93, 72-80, DOI:10.1016/j.microrel.2019.01.001    DOI
8.	A voltage-transient method for characterizing traps in GaN HEMTs Author: Xiang Zheng, Shiwei Feng, Yifu Gao, Yamin Zhang, Yunpeng Jia, Shijie Pan Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.93, 57-60, DOI:10.1016/j.microrel.2018.12.009    DOI
9.	A BICS-based strategy for mitigating the effects of single event transients on SAR converter Author: Jing Gao, Yingguang Ding, Kaiming Nie, Jiangtao Xu Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.93, 45-56, DOI:10.1016/j.microrel.2018.12.013    DOI
10.	A hybrid coding retransmitted chipless tag loaded by microstrip resonator Author: Zhonghua Ma, Chih-Cheng Chen Journal: MICROELECTRONICS RELIABILITY, 2019, Vol.93, 1-7, DOI:10.1016/j.microrel.2018.12.006    DOI

同类著名期刊名称 h-index CiteScore IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE 326 35.20 IEEE Industrial Electronics Magazine 57 16.40 IEEE SIGNAL PROCESSING MAGAZINE 155 14.30 PROCEEDINGS OF THE IEEE 250 20.60 IEEE TRANSACTIONS ON FUZZY SYSTEMS 170 16.20 IEEE TRANSACTIONS ON IMAGE PROCESSING 242 15.60 IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS 236 16.40 PATTERN RECOGNITION 180 13.10 PROGRESS IN QUANTUM ELECTRONICS 58 11.00 IEEE TRANSACTIONS ON POWER ELECTRONICS 222 14.50

中科院JCR同大类学科的热搜期刊 浏览次数 ACS Applied Materials & Interfaces 1539657 CHEMICAL ENGINEERING JOURNAL 1226948 IEEE Access 1197720 APPLIED SURFACE SCIENCE 1184219 JOURNAL OF ALLOYS AND COMPOUNDS 1054574 JOURNAL OF MATERIALS SCIENCE 885233 MATERIALS LETTERS 806004 Nanoscale 715940 ADVANCED MATERIALS 680902 Journal of Materials Chemistry A 658853